Biography

Bio Skecth

Xiao Fu obtained his B.Eng. degree from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, 2005. He received his Master's degree in signal and information systems, also from UESTC, 2010. In October 2014, he received his Ph.D. degree in Electronic Engineering from the Chinese University of Hong Kong (CUHK), Shatin, N.T., Hong Kong. During his Ph.D. study, he worked under the supervision of Prof. Wing-Kin (Ken) Ma. From 2014 to 2017, he was a Postdoctoral Associate at the Department of Electrical and Computer Engineering (ECE), University of Minnesota, Minneapolis, MN 55455, United States. During the years in Minnesota, he worked in the Signal and Tensor Analytics Research (STAR) group under the supervision of Prof. Nikos Sidiropoulos. He joined the School of Electrical Engineering and Computer Science at Oregon State University, Corvallis, OR, United States, in Sep. 2017. In 2023, he was promoted to Associate Professor.

Education and Training

  • University of Minnesota - Twin Cities, Minneapolis, Minnesota, USA, Oct 2014 - Sep 2017, Postdoctoral Associate, Department of Electrical and Computer Engineering & Digital Technology Center

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Honors and Awards

  • Engelbrecht Early Career Award from the College of Engineering, Oregon State University, 2023

    • in recognition of outstanding early career faculty in the College of Engineering

  • 2022 IEEE Signal Processing Society Best Paper Award

  • 2022 IEEE Signal Processing Society Donald G. Fink Overview Paper Award

  • National Science Foundation (NSF) Faculty Early Career Development Program (CAREER) Award, 2022

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  • Best Student Paper Finalist at IEEE SAM 2020 for Qi Lyu, Hangzhou, China, 2020

  • Best Student Paper Award at IEEE MLSP 2019 for Trung Vu, Pittsburgh, USA, 2019

  • Outstanding Postdoctoral Scholar at University of Minnesota, 2016

  • Best Student Paper Award at IEEE CAMSAP 2015 (2nd Prize) for Bo Yang, Cancun, Mexico, Dec. 2015

  • Best Student Paper Award at IEEE ICASSP 2014 (Third Prize), Florence, Italy, May (2014)

  • Finalist of Best Student Paper Competition at IEEE SAM 2014, A Coruna, Spain, June (2014)

  • Qualcomm Travel Grant, IEEE ICASSP 2014 (2014)

  • Scholarship of Oversea Research Attachment Programme (ORAP) to University of Minnesota, Engineering Faculty, CUHK (2013)